MicroTechnology Process Service

Improvement of processing control at the micron scale allow to unleash the potential of the most advanced devices

With state-of-the-art equipment and characterization tools we can establish solid process baselines in order to ensure high-quality and reproducible production

III-Nitride Etching Capabilities

We have developed many etching and deep etching process for III-Nitride alloys in order to respond to any request, from nanoscale etching to low roughness high depth profile with any wall angle

Material Deposition

  • Metal deposition by sputtering and e-beam: Al, Au, Ti, Cr, Ag
  • Dielectric deposition by sputtering: SiO2, SiN, AlOx
  • Atomic Layer Deposition (ALD): SiO2, AlN
  • Phosphor deposition
  • Micro-dispensing and inkjet printing

Characterization Tools

  • Electroluminescence mapping for optoelectronics and electronics with semi-automatic prober
  • Photoluminescence mapping
  • Transmission/Reflectivity measurements
  • HR X-ray diffraction
  • AFM (Atomic Force Microscopy)
  • SEM (Scanning Electron Microscopy)